发明名称 |
THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET-LIKE MOLDED BODY |
摘要 |
<p>Disclosed is a thermally conductive pressure-sensitive adhesive composition (F) obtained by adding a flame-retardant thermally conductive inorganic compound (B) and an expanded graphite powder (E) into an adhesive and/or cohesive composition (S) mainly containing at least one material selected from rubbers, elastomers and resins. Preferably, the composition (S) contains a (meth)acrylate polymer (A1) as a main component; and more preferably, it further contains a (meth)acrylate monomer (A2m). The thermally conductive pressure-sensitive adhesive composition (F) has an excellent balance among flame retardance, hardness and thermal conductivity, and is suitably used as a thermally conductive pressure-sensitive adhesive sheet-like molded body (G) by being molded into a sheet-like shape.</p> |
申请公布号 |
WO2007116686(A1) |
申请公布日期 |
2007.10.18 |
申请号 |
WO2007JP56225 |
申请日期 |
2007.03.26 |
申请人 |
ZEON CORPORATION;SAKAYA, MITSURO;KUMAMOTO, TAKURO |
发明人 |
SAKAYA, MITSURO;KUMAMOTO, TAKURO |
分类号 |
C09J201/00;C09J7/00;C09J11/04 |
主分类号 |
C09J201/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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