发明名称 THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET-LIKE MOLDED BODY
摘要 <p>Disclosed is a thermally conductive pressure-sensitive adhesive composition (F) obtained by adding a flame-retardant thermally conductive inorganic compound (B) and an expanded graphite powder (E) into an adhesive and/or cohesive composition (S) mainly containing at least one material selected from rubbers, elastomers and resins. Preferably, the composition (S) contains a (meth)acrylate polymer (A1) as a main component; and more preferably, it further contains a (meth)acrylate monomer (A2m). The thermally conductive pressure-sensitive adhesive composition (F) has an excellent balance among flame retardance, hardness and thermal conductivity, and is suitably used as a thermally conductive pressure-sensitive adhesive sheet-like molded body (G) by being molded into a sheet-like shape.</p>
申请公布号 WO2007116686(A1) 申请公布日期 2007.10.18
申请号 WO2007JP56225 申请日期 2007.03.26
申请人 ZEON CORPORATION;SAKAYA, MITSURO;KUMAMOTO, TAKURO 发明人 SAKAYA, MITSURO;KUMAMOTO, TAKURO
分类号 C09J201/00;C09J7/00;C09J11/04 主分类号 C09J201/00
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