| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an abrasive compound of high polishing speed capable of suppressing dishing, and to provide a polishing method which uses the abrasive compound. <P>SOLUTION: The abrasive compound contains at least organic particles and inorganic abrasive grains. At least a part of the surface of the organic particles contains a temperature responsive polymer of such nature as dissoluble in water or swells at the temperature lower than a lower limit critical consolute temperature of 25-50°C. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
