LIGHT EMITTING ELEMENT WIRING BOARD AND LIGHT EMITTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a light emitting element wiring board and a light emitting device which are superior in heat dissipation and whose light use efficiency can be improved.

SOLUTION: A metal body 3 whose thermal conductivity is higher than that of a substrate body 2 is disposed in a first through hole 2a penetrating the direction of a Z-axis of the substrate body 2. First and second electrodes 6 and 7 and reflectors 10 whose thermal conductivity is higher than that of the substrate body 2 and which reflect light emitted from an LED chip 21 loaded on a light emitting element loading part 15 are arranged in a plane vertical to the Z-axis direction of the substrate body 2 in one surface in the Z-axis direction of the substrate body 2 and one surface in the Z-axis direction of the metal body 3 at previously decided intervals. Thus, heat generated in the LED chip 21 loaded on the light emitting element loading part 15 is transmitted to the reflector 10 and heat can effectively be radiated from the reflector 10.

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