| 摘要 |
PROBLEM TO BE SOLVED: To provide copper or copper alloy foil for a printed wiring board whose copper layer surface is smooth, excellent in etching characteristics and adhesion with a resin base material. SOLUTION: In the copper or the copper alloy foil, a Cr or Cr alloy layer of a thickness 1-100 nm is formed on the surface of a copper base or a copper alloy foil base by a dry plating method. A Zn concentration in a Cr oxide layer formed on the top surface originating from Cr or a Cr alloy layer is 1 atomic% or higher after the copper or the copper alloy foil is heated at 350°C for fifteen minutes. COPYRIGHT: (C)2008,JPO&INPIT
|
