发明名称 |
Curable organopolysiloxane composition and a semiconductor device made with the use of this composition |
摘要 |
A curable organopolysiloxane composition includes: (A) a straight-chain organopolysiloxane having per molecule at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (B) a branched-chain organopolysiloxane with siloxane units represented by the following general formula: RSiO<SUB>3/2</SUB>, where R is a substituted or unsubstituted monovalent hydrocarbon group, and having per molecule at least one silicon-bonded alkenyl group and at least one silicon-bonded aryl group; (C) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; and a semiconductor device with a semiconductor element coated with a cured body of the aforementioned composition.
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申请公布号 |
US7282270(B2) |
申请公布日期 |
2007.10.16 |
申请号 |
US20050530693 |
申请日期 |
2005.04.08 |
申请人 |
DOW CORNING TORAY SILICONE COMPANY, LTD. |
发明人 |
MORITA YOSHITSUGU;KATO TOMOKO;TOGASHI ATSUSHI;ENAMI HIROJI |
分类号 |
B32B9/04;C08L83/07;C08K5/5419;C08K5/56;C08L83/04;C08L83/05 |
主分类号 |
B32B9/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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