| 摘要 |
<p>A ball grid array package and a memory module using the same are provided to improve the reliability of solder connection by allowing a support unit to limit the thermal expansion of a BGA package and a module substrate. A ball grid array package includes a base substrate(110) having a first surface(111) on which a plurality of conductive pads(112) is formed, a second surface(113) on which a plurality of solder pads(114) is arranged wherein the plurality of solder pads(114) is electrically connected to the conductive pads(112), and a side surface(115) for connecting the first surface(111) to the second surface(113). A semiconductor device(120) is mounted on the first surface(111) and electrically connected to the conductive pads(112). A plurality of support pins is protruded to outside of the second surface(113) at a predetermined length by being inserted into the first surface(111). A sealing unit(150) protects the semiconductor device(120) by encompassing the first surface(111) and fixes the support pins on the base substrate(110). A plurality of solder balls(160) is joined to each of the solder pads(114).</p> |
