| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve strong bonding between a stud bump and a corresponding electrode pad when flip-chip mounting a semiconductor chip on a mounting substrate by using ultrasonic bonding without causing an excessive deformation such that affects high-frequency characteristics in the stud bump. <P>SOLUTION: A semiconductor device is composed of the mounting substrate and the semiconductor chip mounted on the mounting substrate via metal bumps. The metal bumps are respectively composed of an internal part bonded with the semiconductor chip and an external part covering the internal part. The external part has hardness higher than that of the internal part. <P>COPYRIGHT: (C)2008,JPO&INPIT |
