| 摘要 |
An apparatus for cleaning wafers is provided to increase cleaning effect of particles and defects of the wafers and to improve productivity, and uniformity of cleaning effect of the entire surface of the wafers. An apparatus for cleaning wafers includes a single chamber(100), a plurality of wafers(101), and a plurality of wafer mounting parts. The plurality of wafers(101) are disposed in the single chamber(100) and spaced from each other. The plurality of wafers(101) are dependently mounted in the single chamber to maintain horizontality. The plurality of wafer mounting parts, on which the plurality of wafers are mounted, independently grip sides parts of the wafers. The wafer mounting part includes a rotary drive part to independently rotate the wafer(101). The wafers can be rotated at 50 to 2000 rpm.
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