PRINTED-WIRING MATERIAL, AND MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF MULTILAYER PRINTED-WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a printed-wiring material capable of improving press formation properties when forming a multilayer printed-wiring board, enhancing the filling properties of the resin of an adhesive layer between circuits, and machining to the reliable multilayer printed-wiring board. SOLUTION: The printed-wiring board material is formed by providing an adhesive layer 2 on both the surfaces of an insulating base 1, and filling a conductive material 4 into a through-hole 3 that is open on both the surfaces. The thickness of one adhesive layer 2a in the adhesive layers 2 on both the surfaces is made larger than that of the other adhesive layer 2b. COPYRIGHT: (C)2008,JPO&INPIT