| 摘要 |
PROBLEM TO BE SOLVED: To achieve the enhancement of the molding precision of a disk substrate by suppressing the thickness non-uniformity of the disk substrate subjected to injection/compression molding by a toggle type mold clamping device to a tolerable range by the height adjustment of a movable platen. SOLUTION: The movable platen, which permits the insertion of a tie bar and is provided in opposed relation to a mold placing plate, is supported on a machine stand by a support device and moved by a toggle mechanism to close a mold. When the mold placing plate and the parting surface of the mold attached to the movable platen is slightly opened, the cavity formed in the mold is filled with a resin and the mold is clamped during or after the filling of the resin to compression-mold the resin to obtain the disk substrate. The height of the movable platen and the thickness non-uniformity of the disk substrate corresponding to the height displacement quantity of the movable platen or the parallelism of the parting surface are detected to be numerated. The height of the movable platen is adjusted to a proper height by the support device from the thickness non-uniformity or the numerical value of the parallelism. COPYRIGHT: (C)2008,JPO&INPIT |
