发明名称 SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus and a semiconductor manufacturing method capable of treating a wafer with a chemical liquid in an appropriate state efficiently, by detecting whether a filter has been torn by circulating chemical liquid treatment. SOLUTION: The semiconductor manufacturing apparatus comprises: a wafer treatment chamber 11 for treating a wafer by a circulating chemical liquid; a circulation line 12 of the circulating chemical liquid; a first filter 13 that is installed in the circulation line 12 and captures particles in the circulating chemical liquid discharged from the wafer treatment chamber 11; a particle counter 14 that is installed at the primary or secondary side of the first filter 13, and measures the number of particles in the circulating chemical liquid; and an arithmetic processing means 18 for calculating the time differential value of the number of measured particles. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007266211(A) 申请公布日期 2007.10.11
申请号 JP20060087795 申请日期 2006.03.28
申请人 TOSHIBA CORP 发明人 OGUCHI HISASHI;MIYAZAKI KUNIHIRO
分类号 H01L21/304;H01L21/027 主分类号 H01L21/304
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