| 摘要 |
A film type package includes a base film, a driving integrated circuit mounted on the base film for inputting/outputting signals to/from external circuits, a plurality of signal lines formed on the base film for transmitting the signals between the external circuits and the driving integrated circuit, a plurality of bonding pads formed on the base film such that the plurality of signal lines are connected to the external circuits, wherein the plurality of bonding pads correspond to the plurality of signal lines, and a test line connected to the driving integrated circuit for transmitting test signals outputted from the driving integrated circuit, wherein the test line is spaced apart from an adjacent signal line among the plurality of signal lines by a predetermined distance.
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