| 摘要 |
A transceiver module that utilizes an apparatus for providing chassis ground to a printed circuit board located within a connector structure of the transceiver module. In one example embodiment, a ground clip for use in a transceiver module includes a cross-arm, a pair of arms connected to the cross-arm, a pair of fingers each connected to one of the pair of arms, and at least one protrusion connected to the cross-arm. Each finger is configured to be inserted into a hole in a connector structure and configured to be electrically connected to ground contacts of a printed circuit board. The at least one protrusion is configured to bias against, and make reliable electrical contact with, a portion of a transceiver module that is electrically connected to a housing of the transceiver module.
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