发明名称 Bonding Wire and Integrated Circuit Device Using the Same
摘要 A bonding wire comprising a core and a coating layer formed on the core, wherein the coating layer is formed from a metal having a higher melting point than the core, and further has at least one of the following characteristics; 1. the wet contact angle with the coating layer when the core is melted is not smaller than 20 degrees; 2. when the bonding wire is hung down with its end touching a horizontal surface, and is cut at a point 15 cm above the end and thus let drop onto the horizontal surface, the curvature radius of the formed arc is 35 mm or larger; 3. the 0.2% yield strength is not smaller than 0.115 mN/mum<SUP>2 </SUP>but not greater than 0.165 mN/mum<SUP>2</SUP>; or 4. the Vickers hardness of the coating layer is 300 or lower.
申请公布号 US2007235887(A1) 申请公布日期 2007.10.11
申请号 US20040550548 申请日期 2004.10.13
申请人 发明人 KAIMORI SHINGO;NONAKA TSUYOSHI;IOKA MASANORI
分类号 H01L23/52;B23K20/00;H01B5/00;H01L21/60 主分类号 H01L23/52
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