| 发明名称 |
COMPONENT BUILT-IN PRINTED-WIRING BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC EQUIPMENT |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a component built-in printed-wiring board having high connection reliability. <P>SOLUTION: In packaging (solder reflow) of electronic components 40 to be incorporated; the channel of an adhesive resin flowing out of a solder junction 31 is regulated by a solder resist 20, the flow-out of the adhesive resin to an unneeded part is prevented, and the adhesive resin is guided to a gap formed between the lower surface of the electronic components 40 and a component packaging surface, so that a sufficient amount of adhesive resin flows into the gap and the gap is filled with a filler 32. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
| 申请公布号 |
JP2007266379(A) |
申请公布日期 |
2007.10.11 |
| 申请号 |
JP20060090427 |
申请日期 |
2006.03.29 |
| 申请人 |
TOSHIBA CORP |
发明人 |
KARASAWA JUN;SUZUKI DAIGO;TANAKA SHUSUKE |
| 分类号 |
H05K1/18;H01L21/60;H01L23/12;H05K3/34;H05K3/46 |
主分类号 |
H05K1/18 |
| 代理机构 |
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