| 摘要 |
PROBLEM TO BE SOLVED: To remove bubbles stuck to a plating surface in the plating of a wafer or the like. SOLUTION: In the regeneration of a plating solution used for electroplating by a plating solution regeneration mechanism 50 in a jet type plating apparatus 100, the plating solution is passed through a self-resonance tube 90 direct before entering into a filter section 80. The plating solution passed through the self-resonance tube 90 formes a vibrating flow and microbubbles B in the plating solution are joined to each other to turn to large bubbles C by the vibration imparted to the plating solution and come into a spontaneously deaerating state. The plating solution in this state is filtered through a filter 80a to regenerate the plating solution containing no mocrobucbble B. COPYRIGHT: (C)2008,JPO&INPIT
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