| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sensor device capable of improving the yield of a process for joining a sensor substrate and a substrate for packages, and preventing the disconnection of pull-out wiring for electrically connecting the pad of an IC and a metal layer for electrical connection in the sensor substrate; and to provide a manufacturing method of the sensor device. <P>SOLUTION: In the sensor substrate 1 and the first substrate 2 for packages, the metal layers 18, 28 for sealing and the metal layers 19, 29 for electrical connection are joined directly. A step is formed between a first region in which the pad 42 of the IC E2 is formed, and a second region in which the first metal layer 19 for electrical connection and the first metal layer 18 for sealing are formed in a protective insulating layer 40 on the sensor substrate 1. The film thickness of the pull-out wiring 43 formed along the surface of a protective insulating layer 40 and that of the first metal layer 18 for sealing and the first metal layer 19 for electrical connection are set independently, so that the pad 42 of the IC E2 is electrically connected to the first metal layer 19 for electrical connection. <P>COPYRIGHT: (C)2008,JPO&INPIT |
