| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering alloy which is inexpensive and superior in soldering performance, by improving wettability of a Sn-Cu based lead-free soldering alloy which is superior in cost but inferior in wettability to Sn-Ag based lead-free soldering alloy. SOLUTION: In the Sn-Cu based lead-free soldering alloy containing 0.1-3 mass% Cu, 0.001-0.1 mass% P is added either alone or together with 0.001-0.1 mass% Ge. Additionally, as strengthening elements, not more than 4 mass% in total of Ag and/or Sb are added, and if necessary, further one or more elements selected from a group of Ni, Co, Fe, Mn, Cr and Mo may be added in an amount of not more than 0.5 mass% in total. Also, as melting temperature lowering elements, at least one element among Bi, In and Zn may be added in an amount of not more than 5 mass% in total. COPYRIGHT: (C)2008,JPO&INPIT
|
