Moisture resistant printed circuit board

摘要

A printed circuit board structure includes a plurality of layers. The plurality of layers includes at least one metal layer or partial metal layer and at least one dielectric layer of a first type. The plurality of layers also includes two dielectric layers of a second type that is different from the first type. The at least one dielectric layer of the first type is between the two dielectric layers of the second type. The dielectric layers of the second type have a moisture absorption characteristic not in excess of 0.1%.