| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device requiring no redesigning of a new input-output part for a high speed signal by using a semiconductor chip with its operation assured in advance at the input and output part for the high speed signal of a system-in package. SOLUTION: An SiP substrate 100 comprises the system-in package having the semiconductor chip 22 mounted on a package substrate 11, and having a high speed signal input-output part composed of an analog circuit with its operation assured in advance; and a semiconductor chip 21 having a microprocessor, mounted on the package substrate 11 with separated from the semiconductor chip 22, and selected from a plurality of types of semiconductor chip group having an interface transmitting and receiving the high speed signal between the other semiconductor chips with the use of the high speed signal input-output part of the semiconductor chip 22. COPYRIGHT: (C)2008,JPO&INPIT |
