METHOD FOR CONDITIONING A POLISHING PAD

摘要

The present invention provides a method of conditioning processing pads for use in processes such as electrochemical mechanical polishing. A processing pad is provided to perform the polishing, and a conditioning disc is provided to condition the processing pad. Material removal rates in polishing can be increased if the direction of rotation of the processing pad relative to the conditioning disc is opposite the direction of rotation of the processing pad relative to the substrate polishing head. The invention provides an embodiment in which the processing pad and the conditioning disc rotate in a first direction, and the processing pad and the substrate rotate in a second direction.