发明名称 GLASS COMPOSITION FOR SEMICONDUCTOR JUNCTION PROTECTION, PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
摘要 A glass composition for protecting a semiconductor junction is provided, wherein the glass composition for protecting a semiconductor junction contains at least SiO 2 , B 2 O 3 , Al 2 O 3 , ZnO, and at least two oxides of alkaline earth metal selected from a group consisting of CaO, MgO and BaO, and substantially contains none of Pb, P, As, Sb, Li, Na and K. According to the glass composition for protecting a semiconductor junction of the present invention, in the same manner as a conventional case where "a glass material containing lead silicate as a main component" is used, a semiconductor device having a high breakdown voltage can be manufactured by using a glass material containing no lead. Further, according to the glass composition for protecting a semiconductor junction, the glass composition for protecting a semiconductor junction contains at least two oxides of alkaline earth metal selected from a group consisting of CaO, MgO and BaO and hence, an average linear expansion coefficient of the glass composition at a temperature range of 50°C to 550°C becomes close to a linear expansion coefficient of silicon at a temperature range of 50°C to 550°C whereby a semiconductor device of high reliability can be manufactured.
申请公布号 EP2811511(A4) 申请公布日期 2015.11.18
申请号 EP20120837604 申请日期 2012.01.31
申请人 SHINDENGEN ELECTRIC MANUFACTURING CO., LTD. 发明人 MUYARI, KOYA;ITO, KOJI;OGASAWARA, ATSUSHI;ITO, KAZUHIKO
分类号 H01L21/316;C03C3/066;C03C3/093;H01L21/329;H01L23/29;H01L23/31;H01L29/06;H01L29/47;H01L29/861;H01L29/872 主分类号 H01L21/316
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