| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate capable of reducing nano scratch which is significant in high densification, and performing polishing work economically, in a polishing process of a precise parts substrate such as a memory hard disc and a semiconductor element. <P>SOLUTION: The manufacturing method of the substrate includes a step of polishing a substrate by supplying a polishing liquid composition to a polishing machine having a surface plate at a flow rate of 0.06 cm<SP>3</SP>/min or more per polished area 1 cm<SP>2</SP>of the substrate. The polishing liquid composition contains at least polishing material and water, has pH of 0.1 to 7, and includes polishing particles of 0.56 μm or more and less than 1 μm in an amount of 500,000 pieces or less per 1 cm<SP>3</SP>of the polishing liquid composition. <P>COPYRIGHT: (C)2008,JPO&INPIT |
