发明名称 EXPOSURE APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide an exposure apparatus with which a focus error at the time of exposure is avoided and an improvement of yield of the semiconductor device can be achieved, and to provide a manufacturing method of a semiconductor device. <P>SOLUTION: The exposure apparatus is equipped with: a substrate holding part 10 which holds a semiconductor substrate presented to a pattern exposure; an imaging part 12 which images pickup at least a part of a front surface of the substrate holding part 10; a data holder 14 which holds a reference image data which is imaged pickup by the imaging part 12 when the front surface of the substrate holding part 10 is pure; and a data processing part 16 which computes a difference between an inspection image data imaged by the imaging part 12 and the reference image data and judges based on the difference whether the substrate holding part 10 needs to be cleaned. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007266378(A) 申请公布日期 2007.10.11
申请号 JP20060090424 申请日期 2006.03.29
申请人 TOSHIBA CORP 发明人 FUKUHARA KAZUYA;NAKAGAWA SHINICHIRO;SHIOBARA HIDESHI;KAWAMURA DAISUKE
分类号 H01L21/027;G03F7/20 主分类号 H01L21/027
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