| 摘要 |
PROBLEM TO BE SOLVED: To lighten the burden of the decomposition of dissolved material by a persulfuric acid ion, and to reduce running costs by reducing the burden of heat exchange in a cleaning system of a semiconductor substrate by using sulfuric acid. SOLUTION: The system for cleaning the semiconductor substrate 100 with a sulfuric acid solution includes a pretreatment cleaning device 1 using a sulfuric acid solution 3 at a temperature of 150-200°C, and a cleaning device 10 using a sulfuric acid solution 12 at a temperature less than 100-150°C. The persulfuric acid ion can be contained in the sulfuric acid solution of the cleaning device 10 by an electrolysis reaction and the addition of an additive. Preferably, the concentration of sulfuric acid is not less than 8M and is less than 18M in the sulfuric acid solution, thus reducing the burden of the generation of the persulfuric acid ion and the energy for heat exchange. COPYRIGHT: (C)2008,JPO&INPIT
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