| 发明名称 |
SEMICONDUCTOR COMPOUND DEVICE, LED HEAD, AND IMAGE FORMING APPARATUS |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that while wires for coupling an integrated drive circuit to an LED array of elements to be driven are formed beforehand on a semiconductor substrate and a thin film type LED array separately formed is bonded to a free region of the semiconductor substrate in a semiconductor compound device having drive elements and the elements to be driven, the bonding region is limited, thereby hindering the miniaturizing of the device. <P>SOLUTION: A semiconductor film 221 is bonded to a portion above a multilayered wiring layer formed on a substrate 101 with a coating film 220 therebetween. A wiring pattern (metallic wires) 230 undertaking a circuitry operation and a correction pattern 232 for flattening without undertaking the circuitry operation are provided to each wiring layer of the multilayered wiring layer. The surface of the coating layer 220 as an underlayer to which the semiconductor thin film 221 is bonded is made to be flat. <P>COPYRIGHT: (C)2008,JPO&INPIT |
| 申请公布号 |
JP2007260952(A) |
申请公布日期 |
2007.10.11 |
| 申请号 |
JP20060085731 |
申请日期 |
2006.03.27 |
| 申请人 |
OKI DATA CORP;OKI DEGITAL IMAGING:KK |
发明人 |
OGIWARA MITSUHIKO;FUJIWARA HIROYUKI;MUTO MASATAKA;SAGIMORI TOMOHIKO;IGARI YUUKI |
| 分类号 |
B41J2/44;B41J2/45;B41J2/455;H01L21/3205;H01L23/52;H01L33/08;H01L33/20;H01L33/30;H01L33/44;H01L33/58;H04N1/036 |
主分类号 |
B41J2/44 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
