发明名称 PLATE-SHAPE HEAT TRANSPORT DEVICE AND ELECTRONIC DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a plate-shape heat transport device capable of uniformly discharging heat generated in a surface shape within the surface, and to provide an electronic device with the heat transport device mounted thereon. <P>SOLUTION: Working fluid evaporated at the side of an endothermic surface 5a circulates in a flow passage, which is arranged in a surface shape on a Z-Y plane between the endothermic surface 5a and a radiation surface 6a so as to be aligned with the surfaces 5a, 6a. Then, the phase of the working fluid is changed so as to transport heat. Most of the working fluid of a liquid phase is collected at the side of at least a first planar material 5 by at least the capillary force of grooves 7. The grooves 7 are arranged in the surface shape in the first planar material 5, so that the working fluid of the liquid phase is evenly diffused in the first planar material 5 by the capillary force. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007266153(A) 申请公布日期 2007.10.11
申请号 JP20060086871 申请日期 2006.03.28
申请人 SONY CORP 发明人 NAGAI HIROYUKI;YOSHITAKA HIROYUKI
分类号 H05K7/20;F28D15/02;G09F9/00;H04N5/64 主分类号 H05K7/20
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