发明名称 |
APPARATUS, SYSTEM AND METHOD FOR USE IN MOUNTING ELECTRONIC ELEMENTS |
摘要 |
The present embodiments provide surface mount devices and/or systems. In some embodiments, the surface mount devices comprise a casing with a recess in a second surface; a first lead element partially encased by the casing comprising a coupling portion extending interior to the casing generally in a first direction and a chipset portion extending from the first coupling portion at a first acute angle and through an area exposed by the recess; a second lead element partially encased by the casing comprising a second coupling portion extending interior to the casing in a second direction substantially parallel to the first direction and a head portion extending from the second coupling portion at a second acute angle and partially terminating interior to the area exposed by the recess; and the chipset portion comprises a first indentation and a second indentation both extending into the area exposed through the recess.
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申请公布号 |
US2007235845(A1) |
申请公布日期 |
2007.10.11 |
申请号 |
US20060277717 |
申请日期 |
2006.03.28 |
申请人 |
COTCO HOLDINGS LIMITED, A HONG KONG CORPORATION |
发明人 |
XUAN WONG;HUI XIE J.;CHEONG CHENG S. |
分类号 |
H01L23/495;H01L33/48;H01L33/62 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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