| 摘要 |
A method for manufacturing a piezoelectric bimorph actuator for clamping a lead wire of a semiconductor device is provided to reduce a manufacturing cost without an expensive chemical deposition apparatus or sputtering apparatus by coating a conductive metal with a screen printing method. A method for manufacturing a piezoelectric bimorph actuator for clamping a lead wire of a semiconductor device includes the steps of: manufacturing an electrode plate(S10); manufacturing ceramic devices(S20); and adhering the ceramic devices to both surfaces of the electrode plate(S30). The step for manufacturing a ceramic device includes the steps of: forming a ceramic block with ceramic powder including a binder; removing the binder by heating the ceramic block; adhering the ceramic powers of the ceramic block by heating the ceramic block at a temperature below a melting point; polishing the ceramic block with a predetermined thickness; coating conductive metal on both surfaces of the ceramic block; and polarizing the ceramic devices by applying a high DC voltage to the ceramic devices.
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