| 摘要 |
A plasma source ashing apparatus is provided to improve process efficiency and ashing uniformity by providing plasma of high density and uniformity, and to perform HDI(High Dose Implantation) photoresist ashing. A plasma source ashing apparatus includes a remote plasma source(101), a process chamber(103), and a plurality of small plasma sources(105). The process chamber(103) is supplied with plasma through an injection hole from the remote plasma source(101). The plurality of small plasma sources(105) are placed in the upper portion of the process chamber(103). Each of the plurality of small plasma sources(105) is connected to the process chamber(103) through the injection hole. An induction coil surrounds the gas injection hole, and a high frequency power unit applies high frequency power to the induction coil.
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