| 摘要 |
A testing assembly for an electrical test of an electronic package is provided. The testing assembly includes a testing circuit board and a testing socket mounted thereon. The testing socket includes an insulating body and a plurality of pins. The insulating body has a holding surface for supporting a contact surface of the electronic package, and at least one low-dielectric constant region located between two neighboring pins, and the dielectric constant of the low-electric constant region is lower than other regions of the insulating body. In addition, the pins passing through the insulating body are configured as the electric channels between a plurality of contacts on the contact surface and a plurality of testing pads on a conductive layer on a surface of the testing circuit board. Furthermore, the pins include a signal pin, and one end of the signal pin is electrically coupled to the signal testing pad.
|
