| 摘要 |
A method for packaging a flash memory card is provided to increase production efficiency and yield, and apply to a micro or ultra thin flash memory card by packaging the flash memory card with thermosetting plastic and insert molding. A PCB(Printed Circuit Board) is placed on a mold(11). The thermosetting plastic is injected to the mold(12). The PCB is pressed and moved into the injected thermosetting plastic to enable the thermosetting plastic to uniformly cover one side and an outer circumference of the PCB(13). The thermosetting plastic is cured to form a shape of the flash memory card(14). |
