| 发明名称 |
Forming a copper diffusion barrier |
| 摘要 |
Noble metal may be used as a non-oxidizing diffusion barrier to prevent diffusion from copper lines. A diffusion barrier may be formed of a noble metal formed over an adhesion promoting layer or by a noble metal cap over an oxidizable diffusion barrier. The copper lines may also be covered with a noble metal.
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| 申请公布号 |
US7279423(B2) |
申请公布日期 |
2007.10.09 |
| 申请号 |
US20020284576 |
申请日期 |
2002.10.31 |
| 申请人 |
INTEL CORPORATION |
发明人 |
JOHNSTON STEVEN W.;DUBIN VALERY M.;MCSWINEY MICHAEL L.;MOON PETER |
| 分类号 |
H01L21/00;H01L21/285;H01L21/288;H01L21/768;H01L23/532 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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| 地址 |
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