发明名称 METHOD FOR FABRICATING CONDUCTIVE PARTICLE
摘要 A method for manufacturing conductive particles is provided to enhance process safety and lower a production cost by omitting a pre-treatment process for plating, reducing two plating processes into one plating process, and decreasing harmful materials generated from the conventional process. A method for manufacturing conductive particles includes the steps of: (S210) providing polymeric resin-based particles; (S220) forming a nanopowder layer on the surfaces of the polymer resin-based particles; and (S230) performing electroless plating on the formed nanopowder layer. In the step(S220) of forming a nanopowder layer on the surfaces of the polymeric resin-based particles, the nanopowder layer is formed by using a dry physical attachment method. The polymeric resin-based particles are a material selected from the group comprising acrylic, urethane-based, and ethylene-based resins.
申请公布号 KR100765363(B1) 申请公布日期 2007.10.09
申请号 KR20050102912 申请日期 2005.10.31
申请人 KOREA ELECTRONICS TECHNOLOGY INSTITUTE 发明人 LEE, MI JUNG;HONG, SUNG JEI;KIM, WON KEUN;HAN, JEONG IN
分类号 H01B1/22 主分类号 H01B1/22
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