发明名称 |
METHOD FOR FABRICATING CONDUCTIVE PARTICLE |
摘要 |
A method for manufacturing conductive particles is provided to enhance process safety and lower a production cost by omitting a pre-treatment process for plating, reducing two plating processes into one plating process, and decreasing harmful materials generated from the conventional process. A method for manufacturing conductive particles includes the steps of: (S210) providing polymeric resin-based particles; (S220) forming a nanopowder layer on the surfaces of the polymer resin-based particles; and (S230) performing electroless plating on the formed nanopowder layer. In the step(S220) of forming a nanopowder layer on the surfaces of the polymeric resin-based particles, the nanopowder layer is formed by using a dry physical attachment method. The polymeric resin-based particles are a material selected from the group comprising acrylic, urethane-based, and ethylene-based resins. |
申请公布号 |
KR100765363(B1) |
申请公布日期 |
2007.10.09 |
申请号 |
KR20050102912 |
申请日期 |
2005.10.31 |
申请人 |
KOREA ELECTRONICS TECHNOLOGY INSTITUTE |
发明人 |
LEE, MI JUNG;HONG, SUNG JEI;KIM, WON KEUN;HAN, JEONG IN |
分类号 |
H01B1/22 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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