| 摘要 |
A printed circuit board and a method for manufacturing the same are provided to prevent cracks due to a difference of a thermal expansion coefficient by forming an internal insulation layer, which forms a skeleton of a printed circuit board, and an external insulation layer, which forms a surface of the printed circuit board. A printed circuit board includes an internal insulation layer(22), a circuit pattern(24), a connection pad (26), a ball pad(28), and an external insulation layer(30). The circuit pattern(24) is formed on a surface of both sides of the internal insulation layer(22), and is electrically connected to the surface of both sides of the internal insulation layer(22) by a connection bump. The connection pad(26) and the ball pad (28) are selectively formed on the surface of both sides of the internal insulation layer, and perform an electric connection with an external part. The external insulation layer(30) is formed to have the same material with the internal insulation layer(22). The external insulation layer(30) is spread on the surface of both sides of the internal insulation layer(22) except an installation part of the connection pad(26) and the ball pad(28), and covers the circuit pattern(24).
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