| 摘要 |
A method of processing a hole using laser is provided to improve process quality and process efficiency and to obtain a flatter bottom surface of the hole. In a method of processing a hole using laser by moving a laser beam whose diameter is smaller than the diameter of the processed hole, on a spiral track(K1,K2,K3) connecting a center portion(0) of the hole with an outer edge thereof, the track is set at a mutually-rotated position separately about the center portion in order to perforate the hole with desirable depth, when moving the laser beam repeatedly. Damage to the bottom surface of the hole is minimized by deciding the track at the mutually-rotated position about the center portion of the hole, when adopting a concentric track.
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