SUBSTRATE FOR MOUNTING FLIP CHIP AND THE MANUFACTURING METHOD THEREOF

摘要

A substrate for mounting a flip chip and a manufacturing method thereof are provided to prevent copper migration generated in a micro patterning circuit by burying a circuit pattern in an insulator. A method for manufacturing a substrate for mounting a flip chip includes the steps of: laminating a buried pattern substrate with a circuit pattern formed on the surface of a seed layer, on a core substrate having an insulating layer so that the circuit pattern faces the core substrate(100); forming a via hole by punching the seed layer, or the seed layer and a part of the core substrate(110); charging the via hole with conductive paste(130); and removing the seed layer(140). The step of forming a via hole includes the steps of: laminating a dry film on the surface of the seed layer(112); removing a part of the dry film corresponding to a position in which the via hole is formed(114); etching the seed layer of the position in which the dry film is removed(116); peeling off the remaining dry film on the surface of the seed layer(118); and removing the insulator by punching the via hole and exposing the inner layer circuit(120).