FLUX DIPPING APPARATUS FOR ELECTRONIC COMPONENTS

摘要

A flux dipping apparatus for electronic components is provided to prevent a surface oxidation of a bump by securely attaching the bump on a PCB(Printed Circuit Board). A moving guide(120) is coupled with upper and lower portions of a frame(110). A flux storage(160) includes a rotational disk and a fence, which encloses the rotational disk. A flux is contained in the flux storage. A blade unit(170) includes a blade, which is arranged on the rotational disk. A moving block(130) is coupled with the moving guide and is mobile in top and bottom. A position controller(140) controls a height of the moving block. A moving block support unit(150) includes at least one elastic hinge member, which couples the frame with the moving block to support the moving block.