| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To suppress destruction in airtightness between a surface acoustic wave element that is subjected to flip-chip packaging on a wiring board and coated with a sealing resin, and the wiring board in secondary packaging. <P>SOLUTION: In a high-frequency module, the surface acoustic wave element 2, where an annular sealing electrode 24 is provided along the outer periphery on one main surface of a piezoelectric substrate 21, and an IDT electrode 22 and an I/O electrode 23 connected to the IDT electrode 22 are provided at the inner region of the annular sealing electrode 24, is subjected to flip-chip packaging to the surface of the wiring board 1 having a laminated structure comprising a plurality of dielectric layers 11 and a plurality of conductive layers 12. The other surface mount components are packaged on the surface of the wiring board 1, and the surface of the wiring board 1 is covered with a sealing resin layer 4 so that the surface acoustic wave element 2 and the other surface mount components are sealed. In the high-frequency module, an annular gap 41 is formed on the sealing resin layer 4 along the surface acoustic wave element 2 so that the sealing resin layer 4 is divided when viewed from the lamination direction in the wiring board 1. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
