发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <p>A method for manufacturing a semiconductor device is provided to form a polycrystal silicon layer of a large area with low cost by crystallizing an amorphous semiconductor layer formed on a glass substrate at low temperature. A combustion gas is sprayed onto a member containing a metal element, in which the combustion gas is obtained by burning a mixed gas including a gas containing hydrogen atom and oxygen gas. The combustion gas is sprayed onto an amorphous semiconductor film placed on a substrate having an insulating surface. The metal element is added to the vicinity of a surface of the amorphous semiconductor film to enhance re-crystallization of semiconductor. The amorphous semiconductor film is heated with the metal element to modify the amorphous semiconductor film into a polycrystalline semiconductor film.</p>
申请公布号 KR20070097329(A) 申请公布日期 2007.10.04
申请号 KR20070029221 申请日期 2007.03.26
申请人 SEIKO EPSON CORPORATION 发明人 UTSUNOMIYA SUMIO
分类号 H01L21/324;H01L29/786 主分类号 H01L21/324
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