发明名称 FLAME-RETARDANT ADHESIVE COMPOSITION AND FLEXIBLE PRINTED CIRCUIT BOARD PRODUCED BY USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a flame-retardant adhesive composition having excellent solubility in solvent, lamination property, soldering heat-resistance, adhesiveness and mechanical strength. SOLUTION: The flame-retardant adhesive composition contains the following components (A) to (D) as essential components and contains 35-85 pts.wt. of the component (D) based on 100 pts.wt. of the component (A). (A) A thermoplastic resin having a solubility parameter of 8-16, (B) an epoxy resin, (C) a curing agent and (D) a flame-retarding agent composed of a phosphorus-containing polyester resin soluble in organic solvents, containing at least one repeating unit selected from 3 specific chemical formulas having dicarboxylic acid residue and diol residue and having a weight-average molecular weight of 2,000-20,000. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007254659(A) 申请公布日期 2007.10.04
申请号 JP20060083067 申请日期 2006.03.24
申请人 TOKAI RUBBER IND LTD;SANYO CHEM IND LTD 发明人 FUJIKAWA TOMOHIRO;HAYASHI TAKAHIRO;HORIE SEIJI
分类号 C09J201/00;C09J11/06;C09J163/00;C09J167/00;C09J179/08;C09J185/02;H05K1/03 主分类号 C09J201/00
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