| 摘要 |
A method for merging sensor field-mill and electronic lapping guide material placement for a partial mill process and sensor formed according to the method is disclosed. An electronic lapping guide is formed coplanar with a sensor. The coplanar electronic lapping guide and sensor are processed to provide the electronic lapping guide and sensor with predetermined dimensions. The merging of the sensor field-mill and placement of the electronic lapping guide material for partial mill CPP eliminates steps and therefore the cycle time. Moreover, the electronic lapping guide region is raised to the height of the sensor plane to allow the sensor and electronic lapping guide to be defined in the same focal plane of the optics.
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