发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND PHOTOMASK
摘要 <P>PROBLEM TO BE SOLVED: To provide an exposure method capable of enhancing a shot efficiency (that it is desired to make a shot of as large area as possible by single-time exposure). <P>SOLUTION: The semiconductor integrated circuit device includes both a pattern 207 which needs to have a high NA and a pattern 209 which may have a low NA, so the center 211 of exposure is determined by using characteristics of an aperture degree, so that the exposure can be carried out with the aperture degree requested for each of the patterns. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007256406(A) 申请公布日期 2007.10.04
申请号 JP20060078036 申请日期 2006.03.22
申请人 TOSHIBA MICROELECTRONICS CORP;TOSHIBA CORP 发明人 TATSUMI YUICHI
分类号 G03F1/68;G03F7/20;H01L21/027 主分类号 G03F1/68
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