发明名称 Methods of mark-off suppression in superplastic forming and diffusion bonding
摘要 The invention provides methods of superplastic forming and diffusion bonding and a gas inlet tube that facilitates the methods which produce structures that are substantially mark off free. Methods include disposing a sealed pack into a die having a patterned surface and an opposite surface; applying a first pressure within the die around an outside of the pack; applying a second pressure within the pack, the second pressure exceeding the first pressure; and forming the pack by superplastic deformation into a diffusion-bonded structure. Further, a gas inlet tube is provided having an inner tube and an outer tube, where the outer tube is weldable to the pack in a gas tight seal.
申请公布号 US2007228114(A1) 申请公布日期 2007.10.04
申请号 US20060393114 申请日期 2006.03.30
申请人 THE BOEING COMPANY 发明人 SANDERS DANIEL G.;HEFTI LARRY D.;RAMSEY GREGORY L.
分类号 B23K20/00;B23K28/00 主分类号 B23K20/00
代理机构 代理人
主权项
地址