| 摘要 |
The invention relates to a power module comprising a substrate ( 2 ), whose surfaces are provided with at least one electrically conductive layer (4, 6), at least one active semiconductor chip ( 8 ), which is electrically connected to an electrically conductive layer ( 6 ), a film ( 12 ) consisting of an electrically conductive material, which is in close contact with the surfaces of the semiconductor chips ( 8 ) of the electrically conductive layer ( 6 ) and the substrate ( 2 ) and is provided with planar printed conductors ( 16 ). According to the invention: the module is equipped with a second film ( 18 ), which is in close contact with the surfaces of the printed conductors ( 16 ) and the first film ( 12 ); a passive semiconductor chip ( 22 ) is applied to said second film ( 18 ), above the active semiconductor chip ( 8 ) and is electrically connected to the planar printed conductor ( 16 ) lying below by means of a window ( 14 ) that is configured in the second film ( 18 ); the module is equipped with a third film ( 24 ), which is in close contact with the surfaces of the passive semiconductor chip ( 22 ) and the second film ( 18 ) and said third film ( 24 ) is provided with a planar printed conductor ( 28 ), which is conductively connected to the conductive layer ( 6 ) lying below the active semiconductor chip ( 8 ). The invention thus provides a compact power module that can comprise complex topologies.
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