| 摘要 |
A circuit substrate including a first wiring layer, a second wiring layer, a first reference plane, a second reference plane, a first conductive via, and a plurality of second conductive vias is provided. The first wiring layer and the second wiring layer have a first signal trace and a second signal trace respectively. The first conductive via is disposed between the first wiring layer and the second wiring layer for connecting the first signal trace with the second signal trace. The second conductive vias are disposed between the first reference plane and the second reference plane for connecting the first reference plane with the second reference plane, wherein the first conductive via is surrounded by the second conductive vias. |
