ELECTROMAGNETICALLY BONDED PUMPS AND PUMP SUBASSEMBLIES AND METHODS OF FABRICATION

摘要

Example embodiments of piezoelectric pumps and subassemblies for pumps (including diaphragm pumps, both piezoelectric and non- piezoelectric) are formed with structure and/or materials suitable for electromagnetic bonding, and are formed by electromagnetic bonding processes, such as laser welding, for example. In a first example embodiment of electromagnetic bonding pump fabrication technology, a pump is comprised of a base member and a diaphragm layer. The diaphragm layer covers at least a portion of the base member and defines a pumping chamber between the base member and the diaphragm layer. The diaphragm layer comprises a piezoelectric central region selectively deformable upon application of an electrical signal for pumping fluid into and out of the pumping chamber. An electromagnetically transmissive region essentially surrounds the central piezoelectric region.