发明名称 CONNECTION STATE INSPECTION METHOD AND DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a connection state inspection method which enables automatic and accurate determination of the state of pressure-bonding connection of a board that uses ACF. <P>SOLUTION: In the connection state inspection method, the height of a flexible board is measured for each prescribed interval. For the height measurement data, in the surroundings of each prescribed reference position, corresponding to the vicinity of both ends of the pressure bonding connection portion, a range with the same height at a prescribed width is detected as the outermost electrode position. A position which is outside the electrode detected as the outermost electrode position on the flexible board and has a height the same as the electrode detected as the outermost electrode position is detected. The comparison of the distance from the outermost electrode position to the position with the same height is performed in each of both end parts of the pressure bonding connection portion on the flexible board, and this difference is determined as the connection failure, when the difference is not larger than the reference value. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2007256209(A) 申请公布日期 2007.10.04
申请号 JP20060084181 申请日期 2006.03.24
申请人 TOSHIBA CORP 发明人 IGUCHI TOMOHIRO;NAGATSUKA TAKASHI;WAKABAYASHI TOMOMI;OISHI MICHIKO
分类号 G01B11/02;H01R4/04;H01R43/00 主分类号 G01B11/02
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