| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board capable of improving via connection reliability and via thermal reliability. <P>SOLUTION: This wiring board 10 is provided with a structure in which a filling ceramic chip 101 is housed and fixed in a housing hole 92 of a core material 11. A core first main surface side insulating layer 33 having a first via hole 56 formed thereon is arranged on a core first main surface 12 of the core material 11. A first via conductor 51 is formed in the first via hole 56. A core second main surface side insulating layer 34 having a second via hole 66 formed thereon is arranged on a second main surface 13 of the core material 11. A filled via conductor as a second via conductor 61 is formed in the second via hole 66. The first via conductor 51 is a conformal via conductor having a recess portion 60. The recess portion 60 is filled with a hole filling material 17 and is sealed with a via lid plating layer 54. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
