发明名称 PHOTOELECTRIC COMPOSITE SUBSTRATE, AND ELECTRONIC EQUIPMENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a photoelectric composite substrate, along with electronic equipment equipped with it, capable of preventing degradation in manufacture yield due to damage on a mold part with no increase of a manufacturing cost. <P>SOLUTION: The photoelectric composite substrate 10 comprises a substrate 11, a printed wiring 12 and a thin optical element 13 formed on a front surface 11a side of the substrate 11. The thin optical element 13 has an electrode formed on its front surface, allowing at least inputting/outputting of light from the front surface, and the rear surface of it is mounted on the substrate 11 by bonding it to the front surface 11a of the substrate 11. The thin optical element 13 is covered with a lens mold 14. In the lens mold 14, a lens element 16 that refracts the light inputted/outputted with the thin optical element 13 is formed in a Fraunhofer region of the light inputted/outputted with the thin optical element 13. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2007258667(A) 申请公布日期 2007.10.04
申请号 JP20060256861 申请日期 2006.09.22
申请人 SEIKO EPSON CORP 发明人 KONDO TAKAYUKI
分类号 H01S5/183;G02B1/04 主分类号 H01S5/183
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